On June 9, JCET introduced a new high‑density 3D power module packaging and test solution for AI data centers. Built on its proprietary XDPKG‑3DSiP 3D system‑in‑package technology, the solution uses high‑density multilayer interconnection and 3D modular integration to optimize power devices, passive components, interconnect structures, and thermal paths – improving power density, efficiency, thermal management, and long‑term reliability.

The global AI server power module market is expected to grow from $7.4B in 2025 to $32.5B in 2027 , a CAGR of 110%. JCET’s solution covers wafer‑level processing for power management chips and DrMOS, and full SiP module assembly. Key process technologies include copper pillar interconnect , ECP substrate , and high‑density packaging.

Compared to the previous generation, power density increases by more than 20% , allowing higher compute capacity within limited rack/board space. The solution also introduces multiphysics collaborative design (electrical, thermal, mechanical simulation) to shorten development cycles and reduce mass‑production risk.

Dr. Chen Lingzhi, JCET VP and GM of Industrial & Intelligent Application BU, noted that JCET now offers a complete packaging solution covering AI compute, memory, connectivity, and power management.

ICgoodFind: JCET’s 3D power module solution boosts density and thermal performance – a key enabler for AI server power delivery.